First published: Mon Jul 02 2018(Updated: )
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Credit: product-security@qualcomm.com
Affected Software | Affected Version | How to fix |
---|---|---|
Qualcomm Sd 425 Firmware | ||
Qualcomm Sd 425 | ||
Qualcomm Sd 427 Firmware | ||
Qualcomm Sd 427 | ||
Qualcomm Sd 430 Firmware | ||
Qualcomm Sd 430 | ||
Qualcomm Sd 435 Firmware | ||
Qualcomm Sd 435 | ||
Qualcomm Sd 450 Firmware | ||
Qualcomm Sd 450 | ||
Qualcomm Sd 625 Firmware | ||
Qualcomm Sd 625 | ||
Google Android | ||
Qualcomm Sd 810 | ||
Qualcomm Sd 820 Firmware | ||
Qualcomm Sd 820 | ||
Qualcomm Sd 835 Firmware | ||
Qualcomm Sd 835 | ||
Qualcomm Sdm630 Firmware | ||
Qualcomm Sdm630 | ||
Qualcomm Sdm636 Firmware | ||
Qualcomm Sdm636 | ||
Qualcomm Sdm660 Firmware | ||
Qualcomm Sdm660 | ||
Qualcomm Snapdragon High Med 2016 Firmware | ||
Qualcomm Snapdragon High Med 2016 | ||
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CVE-2017-18173 has a high severity level due to the potential for exploitation through an integer underflow.
To fix CVE-2017-18173, ensure that your device firmware is updated to the latest version provided by Qualcomm.
CVE-2017-18173 affects Snapdragon Mobile chipsets including SD 425, SD 427, SD 430, and others.
CVE-2017-18173 is primarily a software vulnerability related to the firmware of Qualcomm Snapdragon chipsets.
The impacts of CVE-2017-18173 may include system instability and unauthorized access due to the exploitation of the integer underflow.