First published: Mon Jul 02 2018(Updated: )
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Credit: product-security@qualcomm.com
Affected Software | Affected Version | How to fix |
---|---|---|
Android | ||
Qualcomm SDR425 Firmware | ||
Qualcomm Snapdragon 425 | ||
Qualcomm SD427 Firmware | ||
Qualcomm SD 427 firmware | ||
Qualcomm SD 430 Firmware | ||
Qualcomm SD 430 Firmware | ||
qualcomm sd435 firmware | ||
Qualcomm Snapdragon 435 | ||
Qualcomm SDM450 Firmware | ||
Qualcomm SDM450 | ||
Qualcomm SD 625 Firmware | ||
Qualcomm Snapdragon 625 | ||
Qualcomm Snapdragon 810 Firmware | ||
Qualcomm Snapdragon 810 | ||
Qualcomm SD820 Firmware | ||
Qualcomm SD820 Firmware | ||
Qualcomm SD835 Firmware | ||
Qualcomm Snapdragon 835 | ||
Qualcomm SDM630 | ||
Qualcomm SDM630 Firmware | ||
Qualcomm SD 636 Firmware | ||
Qualcomm SDM636 Firmware | ||
Qualcomm SD660 Firmware | ||
Qualcomm Snapdragon 660 | ||
Qualcomm Snapdragon High Med 2016 | ||
Qualcomm Snapdragon |
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CVE-2017-18173 has a high severity level due to the potential for exploitation through an integer underflow.
To fix CVE-2017-18173, ensure that your device firmware is updated to the latest version provided by Qualcomm.
CVE-2017-18173 affects Snapdragon Mobile chipsets including SD 425, SD 427, SD 430, and others.
CVE-2017-18173 is primarily a software vulnerability related to the firmware of Qualcomm Snapdragon chipsets.
The impacts of CVE-2017-18173 may include system instability and unauthorized access due to the exploitation of the integer underflow.