CVE-2019-2327: Buffer Overflow
Possible buffer overflow can occur when playing clip with incorrect element size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SnapdragonHighMed2016
Affected Software
Event History
Frequently Asked Questions
What is the severity of CVE-2019-2327?
CVE-2019-2327 has a high severity due to the risk of a buffer overflow that can lead to potential code execution.
How do I fix CVE-2019-2327?
To mitigate CVE-2019-2327, users should update the affected Qualcomm firmware to the latest version provided by Qualcomm or their device manufacturers.
What products are affected by CVE-2019-2327?
CVE-2019-2327 affects various Qualcomm Snapdragon chips including MDM9150, MDM9206, MDM9607, and other related products, primarily in automotive and IoT sectors.
Can CVE-2019-2327 be exploited remotely?
Yes, CVE-2019-2327 can potentially be exploited remotely if an attacker sends a specially crafted clip to the vulnerable device.
What devices should I check for CVE-2019-2327 vulnerability?
Users should check devices using Qualcomm Snapdragon Auto, Compute, Consumer IoT, and similar platforms that incorporate the vulnerable chipsets.