First published: Thu Oct 19 2023(Updated: )
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
Credit: cert@ncsc.nl cert@ncsc.nl
Affected Software | Affected Version | How to fix |
---|---|---|
Ti Omap L138 Firmware | ||
Ti Omap L138 |
Sign up to SecAlerts for real-time vulnerability data matched to your software, aggregated from hundreds of sources.
CVE-2022-25334 is a vulnerability in the Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) that allows a stack overflow by exploiting a lack of bounds check on the signature size field.
CVE-2022-25334 affects the Ti Omap L138 Firmware by allowing an attacker to cause a stack overflow, potentially affecting secure kernel data.
The severity of CVE-2022-25334 is high, with a severity value of 8.2.
CVE-2022-25334 can be exploited by using a module with a sufficiently large signature field to trigger a stack overflow.
No, the Ti Omap L138 device is not vulnerable to CVE-2022-25334.