CVE-2022-41175: Buffer Overflow
First published: Tue Oct 11 2022(Updated: )
Due to lack of proper memory management, when a victim opens a manipulated Enhanced Metafile (.emf, emf.x3d) file received from untrusted sources in SAP 3D Visual Enterprise Author - version 9, it is possible that a Remote Code Execution can be triggered when payload forces a stack-based overflow or a re-use of dangling pointer which refers to overwritten space in memory.
Credit: cna@sap.com
| Affected Software | Affected Version | How to fix |
|---|---|---|
| SAP 3D Visual Enterprise Author | =9.0 |
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Reference Links
Frequently Asked Questions
What is CVE-2022-41175?
CVE-2022-41175 refers to a vulnerability in SAP 3D Visual Enterprise Author version 9 that allows remote code execution through a manipulated Enhanced Metafile (.emf) file.
How severe is CVE-2022-41175?
CVE-2022-41175 has a severity score of 7.8 (high).
Which software is affected by CVE-2022-41175?
SAP 3D Visual Enterprise Author version 9 is affected by CVE-2022-41175.
How can an attacker exploit CVE-2022-41175?
An attacker can exploit CVE-2022-41175 by sending a manipulated Enhanced Metafile (.emf) file to a victim, which can trigger a remote code execution.
Are there any references available for CVE-2022-41175?
Yes, you can find references for CVE-2022-41175 at the following links: [link1], [link2].
- collector/nvd-index
- agent/references
- agent/softwarecombine
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- source/MITRE
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- agent/last-modified-date
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- vendor/sap
- canonical/sap 3d visual enterprise author
- version/sap 3d visual enterprise author/9.0