Transient DOS while processing received beacon frame.
Information disclosure while decoding this RTP packet Payload when UE receives the RTP packet from the network.
Transient DOS may occur while processing malformed length field in SSID IEs.
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
Information disclosure when UE receives the RTP packet from the network, while decoding and reassembling the fragments from RTP packet.
Transient DOS while parsing the EPTM test control message to get the test pattern.
Information disclosure while decoding RTP packet received by UE from the network, when payload length mentioned is greater than the available buffer length.
Cryptographic issue while performing RSA PKCS padding decoding.
Memory corruption during PlayReady APP usecase while processing TA commands.
Memory corruption while processing a GP command response.
Possible use after free in Display due to race condition while creating an external display in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Memory Corruption in SPS Application while exporting public key in sorter TA.
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
Information disclosure may occur during a video call if a device resets due to a non-conforming RTCP packet that doesnt adhere to RFC standards.
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
Memory corruption in Audio while processing the VOC packet data from ADSP.
Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains IPPROTONONE as the next header.
Information disclosure in WLAN HOST while processing the WLAN scan descriptor list during roaming scan.
Memory Corruption in WLAN HOST while fetching TX status information.
Memory Corruption in Linux while processing QcRilRequestImsRegisterMultiIdentityMessage request.
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Memory corruption in HLOS while running playready use-case.