Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while processing video packets received from video firmware.
Possible out of bound read in DRM due to improper buffer length check. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption while loading an ELF segment in TEE Kernel.
Information disclosure while processing a firmware event.
Memory corruption while handling buffer mapping operations in the cryptographic driver.
Memory Corruption in HLOS while registering for key provisioning notify.
Memory corruption in Core Services while executing the command for removing a single event listener.
Memory corruption when BTFM client sends new messages over Slimbus to ADSP.
Memory corruption while processing command in Glink linux.
Memory Corruption in Core due to secure memory access by user while loading modem image.
Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.
Memory corruption in TZ Secure OS while requesting a memory allocation from TA region.
Memory corruption in HLOS while running playready use-case.
Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
memory corruption in video due to buffer overflow while parsing asf clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to stack-based buffer overflow in Core
Memory corruption in Core due to stack-based buffer overflow.
Memory corruption in core due to stack-based buffer overflow
Information disclosure due to buffer overread in Core
Information disclosure due to buffer overread in Core
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.
Memory corruption in Core Platform while printing the response buffer in log.
Memory Corruption in Core Platform while printing the response buffer in log.
Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key.
Transient DOS while loading the TA ELF file.