Memory corruption in Kernel while parsing metadata.
Information disclosure while handling T2LM Action Frame in WLAN Host.
Information disclosure while handling SA query action frame.
INformation disclosure while handling Multi-link IE in beacon frame.
Information disclosure while handling beacon or probe response frame in STA.
Information disclosure while handling beacon probe frame during scan entry generation in client side.
Information Disclosure when processing advertisement frames with malformed MBSSID elements of insufficient length.
Memory corruption in WLAN Host when the firmware invokes multiple WMI Service Available command.
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Improper authentication of un-encrypted plaintext Wi-Fi frames in an encrypted network can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Information exposure in DSP services due to improper handling of freeing memory
Information Disclosure in WLAN Host when processing WMI event command.
Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Memory corruption while processing MBSSID beacon containing several subelement IE.
Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Memory corruption due to improper access control in Qualcomm IPC.
Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length.
Transient DOS while parsing the MBSSID IE from the beacons, when the MBSSID IE length is zero.
Transient DOS while parsing the multiple MBSSID IEs from the beacon, when the tag length is non-zero value but with end of beacon.
Transient DOS while parsing fragments of MBSSID IE from beacon frame.
Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame.
Transient DOS while parsing the received TID-to-link mapping action frame.
Transient DOS when driver accesses the ML IE memory and offset value is incremented beyond ML IE length.