Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Information disclosure in Audio while accessing AVCS services from ADSP payload.
Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Memory corruption in Audio while processing IIR config data from AFE calibration block.
Transient DOS in Audio when invoking callback function of ASM driver.
Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Memory corruption when there is failed unmap operation in GPU.
Information disclosure when the ADSP payload size received in HLOS in response to Audio Stream Manager matrix session is less than this expected size.
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to improper access control in Qualcomm IPC.
Transient DOS while parsing ESP IE from beacon/probe response frame.
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption when two threads try to map and unmap a single node simultaneously.
Memory corruption when user provides data for FM HCI command control operations.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Transient DOS may occur while processing the country IE.
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
Memory corruption in Audio during playback session with audio effects enabled.
Memory corruption in Graphics while processing user packets for command submission.
Transient DOS in WLAN Host while doing channel switch announcement (CSA), when a mobile station receives invalid channel in CSA IE.
Memory corruption in Graphics while importing a file.
Information disclosure in WLAN HOST while processing the WLAN scan descriptor list during roaming scan.
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking