Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Memory corruption when there is failed unmap operation in GPU.
Memory corruption when the payload received from firmware is not as per the expected protocol size.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.
Transient DOS while parsing ESP IE from beacon/probe response frame.
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption when two threads try to map and unmap a single node simultaneously.
Memory corruption when user provides data for FM HCI command control operations.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Possible out of bound access in audio module due to lack of validation of user provided input.
Possible out of bound read due to improper validation of IE length during SSID IE parse when channel is DFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Memory corruption while calling the NPU driver APIs concurrently.
Transient DOS may occur while processing the country IE.
Memory corruption may occur while validating ports and channels in Audio driver.
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
Memory corruption while handling file descriptor during listener registration/de-registration.
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.
Memory corruption in Graphics while processing user packets for command submission.
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while processing video packets received from video firmware.
Memory corruption in Graphics while importing a file.
Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking