Memory corruption while processing MBSSID beacon containing several subelement IE.
Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
Memory corruption while redirecting log file to any file location with any file name.
Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in reassoc response frame.
Memory corruption while redirecting log file to any file location with any file name.
Memory corruption while parsing the ML IE due to invalid frame content.
Memory corruption during management frame processing due to mismatch in T2LM info element.
Memory corruption in WLAN Firmware while doing a memory copy of pmk cache.
Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption due to stack based buffer overflow in WLAN having invalid WNM frame length.
Memory corruption in WLAN Firmware while parsing a NAN management frame carrying a S3 attribute.
Memory corruption while sending an Assoc Request having BTM Query or BTM Response containing MBO IE.
Memory corruption in WLAN Host while processing RRM beacon on the AP.
Memory corruption in Core Services while executing the command for removing a single event listener.
Cryptographic issue when a controller receives an LMP start encryption command under unexpected conditions.
Possible out of bound read due to improper validation of IE length during SSID IE parse when channel is DFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Information disclosure in WLAN due to improper length check while processing authentication handshake in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Cryptographic issues in BSP due to improper hash verification in Snapdragon Wired Infrastructure and Networking
Memory corruption while performing SCM call.
Memory corruption while performing SCM call with malformed inputs.
Memory corruption while processing a GP command response.
Memory Corruption when processing invalid HT40 channel layouts during dynamic channel switching operations.
Memory corruption while processing TPC target power table in FTM TPC.
Memory corruption due to improper access control in Qualcomm IPC.
Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.
Memory corruption due to improper validation of array index in WLAN HAL when received lmitemNum is out of range.
Memory corruption due to buffer copy without checking size of input in modem while receiving WMIREQUESTSTATSCMDID command.
Memory corruption in WLAN due to incorrect type cast while sending WMISCANSCHPRIOTBLCMDID message.
Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase.
Memory corruption in WLAN HAL while arbitrary value is passed in WMI UTF command payload.