Possible buffer overflow due to improper parsing of headers while playing the FLAC audio clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in reassoc response frame.
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
memory corruption in video due to buffer overflow while parsing asf clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in TZ Secure OS while requesting a memory allocation from TA region.
Memory corruption in HLOS while running playready use-case.
Memory corruption due to double free in core while initializing the encryption key.
Cryptographic issue when a controller receives an LMP start encryption command under unexpected conditions.
Possible out of bound read due to improper validation of IE length during SSID IE parse when channel is DFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory corruption while loading an ELF segment in TEE Kernel.
Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command.
Memory corruption when BTFM client sends new messages over Slimbus to ADSP.
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.
Memory corruption due to improper validation of array index in WLAN HAL when received lmitemNum is out of range.
Memory corruption in Graphics while processing user packets for command submission.
Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region.
Memory Corruption in HLOS while registering for key provisioning notify.
Memory corruption in DSP Service during a remote call from HLOS to DSP.
Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Memory corruption in Core due to stack-based buffer overflow.
Memory corruption in core due to stack-based buffer overflow
Memory corruption in WLAN due to incorrect type cast while sending WMISCANSCHPRIOTBLCMDID message.
Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase.
Possible use after free due to lack of null check of DRM file status after file structure is freed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.
Possible unauthorized access to secure space due to improper check of data allowed while flashing the no access control device configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Memory Corruption in Core due to secure memory access by user while loading modem image.