Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Memory corruption when there is failed unmap operation in GPU.
Memory corruption when the payload received from firmware is not as per the expected protocol size.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.
Transient DOS while parsing ESP IE from beacon/probe response frame.
Memory corruption while calculating total metadata size when a very high reserved size is requested by gralloc clients.
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption when two threads try to map and unmap a single node simultaneously.
Memory corruption when user provides data for FM HCI command control operations.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Possible out of bound read due to improper validation of IE length during SSID IE parse when channel is DFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible out of bound read due to improper length calculation of WMI message. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
An Out of Bounds read may potentially occur while processing an IBSS beacon, in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Memory corruption while calling the NPU driver APIs concurrently.
Transient DOS may occur while processing the country IE.
Memory corruption may occur while validating ports and channels in Audio driver.
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
Memory corruption while handling file descriptor during listener registration/de-registration.
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.
Memory corruption in Graphics while processing user packets for command submission.
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while processing video packets received from video firmware.