Memory corruption when AP includes TID to link mapping IE in the beacons and STA is parsing the beacon TID to link mapping IE.
Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size.
Memory corruption while validating the TID to Link Mapping action request frame, when a station connects to an access point.
Memory corruption in video while parsing invalid mp2 clip.
Memory corruption while processing MBSSID beacon containing several subelement IE.
Memory corruption while parsing beacon/probe response frame when AP sends more supported links in MLIE.
Memory corruption while parsing qcp clip with invalid chunk data size.
Memory corruption while processing Codec2 during v13k decoder pitch synthesis.
Memory corruption while playing audio file having large-sized input buffer.
Memory corruption while parsing the ML IE due to invalid frame content.
Memory corruption during management frame processing due to mismatch in T2LM info element.
Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.
Memory Corruption when processing Device Capability Extended attributes in certain NAN Service Discovery Frames with invalid length values.
Memory corruption in HLOS while running playready use-case.
Memory corruption in Core while processing control functions.
Memory corruption in Core Services while executing the command for removing a single event listener.
Memory corruption in TZ Secure OS while Tunnel Invoke Manager initialization.
Memory corruption in Hypervisor when platform information mentioned is not aligned.
Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory.
Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Non-secure region can try modifying RG permissions of IO space xPUs due to improper input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.
Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.
Memory corruption due to double free in core while initializing the encryption key.
Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.
Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment.
Memory Corruption in Core due to incorrect type conversion or cast in secureioread/write function in TEE.
Information Disclosure while parsing beacon frame in STA.
Cryptographic issue when a controller receives an LMP start encryption command under unexpected conditions.
Memory corruption due to untrusted pointer dereference in automotive during system call.