Information disclosure in WLAN HOST while processing the WLAN scan descriptor list during roaming scan.
Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Denial of service in BOOT when partition size for a particular partition is requested due to integer overflow when blocks are calculated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Information exposure in DSP services due to improper handling of freeing memory
Memory corruption in display due to double free while allocating frame buffer memory
Denial of service while processing fastboot flash command on mmc due to buffer over read
Memory corruption in WLAN due to use after free
Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Information disclosure in Audio while accessing AVCS services from ADSP payload.
Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Memory corruption in Audio while processing IIR config data from AFE calibration block.
Transient DOS in Audio when invoking callback function of ASM driver.
Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Memory corruption when there is failed unmap operation in GPU.
Memory corruption when IOMMU unmap of a GPU buffer fails in Linux.
Information disclosure when the ADSP payload size received in HLOS in response to Audio Stream Manager matrix session is less than this expected size.
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
Memory corruption while handling user packets during VBO bind operation.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to access of uninitialized pointer in Bluetooth HOST while processing the AVRCP packet.
Memory corruption due to improper access control in Qualcomm IPC.
Transient DOS while parsing ESP IE from beacon/probe response frame.
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption when two threads try to map and unmap a single node simultaneously.