Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Information disclosure in Audio while accessing AVCS services from ADSP payload.
Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Memory corruption in Audio while processing IIR config data from AFE calibration block.
Transient DOS in Audio when invoking callback function of ASM driver.
Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Memory corruption when there is failed unmap operation in GPU.
Information disclosure when the ADSP payload size received in HLOS in response to Audio Stream Manager matrix session is less than this expected size.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to access of uninitialized pointer in Bluetooth HOST while processing the AVRCP packet.
Memory corruption due to improper access control in Qualcomm IPC.
Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.
Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine.
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption when two threads try to map and unmap a single node simultaneously.
Memory corruption when user provides data for FM HCI command control operations.
Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Transient DOS while parsing the ML IE when a beacon with common info length of the ML IE greater than the ML IE inside which this element is present.
Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption while power-up or power-down sequence of the camera sensor.
Memory corruption in Camera due to unusually high number of nodes passed to AXI port.
Memory corruption in display driver while detaching a device.
Memory corruption may occur during the synchronization of the cameras frame processing pipeline.
Memory corruption while handling multuple IOCTL calls from userspace for remote invocation.
Transient DOS may occur while processing the country IE.