Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCSLOADMODULE command.
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Memory corruption while running NPU, when NETWORKUNLOAD and (NETWORKUNLOAD or NETWORKEXECUTEV2) commands are submitted at the same time.
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Memory corruption when there is failed unmap operation in GPU.
Memory corruption when the payload received from firmware is not as per the expected protocol size.
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Transient DOS while parsing ESP IE from beacon/probe response frame.
Memory corruption while calculating total metadata size when a very high reserved size is requested by gralloc clients.
Memory corruption when two threads try to map and unmap a single node simultaneously.
Memory corruption while handling session errors from firmware.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Memory corruption while calling the NPU driver APIs concurrently.
Transient DOS may occur while processing the country IE.
Memory corruption may occur while validating ports and channels in Audio driver.
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
Memory corruption while handling file descriptor during listener registration/de-registration.
Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur.
Memory corruption while reading the FW response from the shared queue.
Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware.
Memory corruption while processing video packets received from video firmware.
Memory corruption in Graphics while importing a file.
Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.
Memory corruption while invoking callback function of AFE from ADSP.
Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Improper authentication of sub-frames of a multicast AMSDU frame can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking