Memory corruption while sending SMS from AP firmware.
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
Memory Corruption in Audio while invoking callback function in driver from ADSP.
Memory corruption in Audio while processing the VOC packet data from ADSP.
Transient DOS in WLAN Firmware while parsing a NAN management frame.
Cryptographic issue in Data Modem due to improper authentication during TLS handshake.
Transient DOS in WLAN Firmware while parsing rsn ies.
Information disclosure in WLAN HOST while processing the WLAN scan descriptor list during roaming scan.
Memory Corruption in Audio while allocating the ion buffer during the music playback.
Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption.
Transient DOS in WLAN Firmware while parsing no-inherit IES.
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
Memory corruption in video due to configuration weakness. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Memory corruption in graphics due to buffer overflow while validating the user address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to stack-based buffer overflow in Core
Information disclosure due to buffer overread in Core
Memory corruption due to improper validation of array index in WLAN HAL when received lmitemNum is out of range.
Memory corruption due to double free in Core while mapping HLOS address to the list.
Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode.
Memory Corruption in Core due to incorrect type conversion or cast in secureioread/write function in TEE.
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
Memory corruption while processing key blob passed by the user.
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
Transient DOS due to reachable assertion in Modem during OSI decode scheduling.
Memory corruption in Automotive due to Improper Restriction of Operations within the Bounds of a Memory Buffer while exporting a shared key.
Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory.
Improper handling of permissions of a shared memory region can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Transient DOS in WLAN Firmware while interpreting MBSSID IE of a received beacon frame.
Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.