Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCSLOADMODULE command.
The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption.
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
Memory corruption while running VK synchronization with KASAN enabled.
Memory corruption while running NPU, when NETWORKUNLOAD and (NETWORKUNLOAD or NETWORKEXECUTEV2) commands are submitted at the same time.
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
Memory corruption in Audio while processing the calibration data returned from ACDB loader.
Memory corruption in Audio while processing IIR config data from AFE calibration block.
Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points.
Memory corruption when there is failed unmap operation in GPU.
Memory corruption when IOMMU unmap of a GPU buffer fails in Linux.
Memory corruption when the payload received from firmware is not as per the expected protocol size.
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
Memory corruption when allocating and accessing an entry in an SMEM partition.
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Memory corruption due to access of uninitialized pointer in Bluetooth HOST while processing the AVRCP packet.
Memory corruption due to improper access control in Qualcomm IPC.
Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.
Transient DOS while parsing ESP IE from beacon/probe response frame.
Memory corruption while calculating total metadata size when a very high reserved size is requested by gralloc clients.
Transient DOS while handling PS event when Program Service name length offset value is set to 255.
Memory corruption when Alternative Frequency offset value is set to 255.
Memory corruption when two threads try to map and unmap a single node simultaneously.
Memory corruption when user provides data for FM HCI command control operations.
Memory corruption while handling session errors from firmware.
Memory corruption while processing voice packet with arbitrary data received from ADSP.
Memory corruption while processing GPU page table switch.
Possible out of bound read due to improper validation of IE length during SSID IE parse when channel is DFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Possible out of bound read due to improper length calculation of WMI message. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables